Principal System/Rack Mechanical Engineer

Astera Labs (NASDAQ: ALAB) provides rack-scale AI infrastructure through purpose-built connectivity solutions. By collaborating with hyperscalers and ecosystem partners, Astera Labs enables organizations to unlock the full potential of modern AI. Astera Labs’ Intelligent Connectivity Platform integrates CXL®, Ethernet, NVLink, PCIe®, and UALink™ semiconductor-based technologies with the company’s COSMOS software suite to unify diverse components into cohesive, flexible systems that deliver end-to-end scale-up, and scale-out connectivity. The company’s custom connectivity solutions business complements its standards-based portfolio, enabling customers to deploy tailored architectures to meet their unique infrastructure requirements. Discover more at www.asteralabs.com. Senior Principal Mechanical Engineer Location: Research Triangle Park (RTP), North Carolina Department: Hardware Engineering / System Architecture Employment Type: Full-Time We are seeking a Senior Principal Mechanical Engineer to lead mechanical architecture and system integration across next-generation AI platforms, optical networking systems, and rack-scale infrastructure solutions. The Opportunity This is a highly visible leadership role responsible for developing mechanical architecture across: PCIe Scale-Up AI Infrastructure UALink Rack-Scale Fabrics Ethernet Scale-Out Systems ESUN Network Architectures GPU Compute Platforms Open Rack Systems Fiber Connectivity Infrastructure NPO (Near Package Optics) CPO (Co-Packaged Optics) Air-Cooled and Liquid-Cooled AI Platforms You will work closely with Thermal, Power, Electrical, Silicon, Software, and System Architecture teams, as well as ODM partners including Accton, Hyve, Wistron, Quanta, and Gigabyte. What You'll Do Lead Mechanical Architecture for AI Platforms Define mechanical architecture from device-level products through complete rack-scale AI systems. Develop scalable mechanical designs supporting future generations of AI infrastructure. Establish system-level design requirements balancing: Performance Reliability Manufacturability Serviceability Cost Sustainability Design Rack-Scale AI Infrastructure Own mechanical architecture for: GPU Compute Platforms PCIe Scale-Up Switch Platforms UALink Switch Platforms Optical Connectivity Systems Rack Controllers Rack Enclosures Cable Management Systems Open Rack Platforms Drive solutions that support high-density AI computing deployments. Develop Open Rack and Rack-Level Mechanical Solutions Define rack layouts and mechanical interfaces. Develop scalable rack architecture standards. Drive mechanical integration of: Compute systems Switch platforms Power shelves Cooling infrastructure Optical connectivity Management systems Support future multi-rack AI factory deployments. Enable Fiber Connectivity and Optical Systems Develop mechanical solutions supporting: Fiber Infrastructure Optical Engines Silicon Photonics NPO Architectures CPO Architectures Rack-to-Rack Optical Connectivity Address challenges associated with: Cable routing Bend radius management Serviceability Fiber protection Field replaceability Support Air-Cooled and Liquid-Cooled Systems Partner with Thermal Engineering teams to: Optimize airflow architecture. Develop liquid cooling mechanical solutions. Support cold plate integration. Define coolant distribution infrastructure. Improve overall system cooling efficiency. Drive Mechanical Design for Manufacturability Define manufacturing-ready mechanical solutions. Support supplier and ODM engagement. Drive cost optimization efforts. Establish assembly and service procedures. Improve production scalability and operational efficiency. Lead System Integration Activities Work closely with: Electrical Engineering Thermal Engineering Power Architecture Silicon Development Product Management Manufacturing Teams to ensure complete system integration and design alignment. Collaborate with ODM Partners Work directly with Accton, Hyve, Wistron, Quanta, Gigabyte, and other ODMs to: Define mechanical requirements. Review platform designs. Resolve integration challenges. Drive Open Rack implementation. Support design validation and manufacturing readiness. Required Qualifications Bachelor's, Master's, or PhD in Mechanical Engineering or related discipline. 15+ years of experience in mechanical design and system integration. Proven experience leading mechanical architecture for: Servers Networking Platforms Storage Systems AI Infrastructure Data Center Hardware Expertise in: Sheet Metal Design Structural Analysis Tolerance Analysis Mechanical Packaging Cable Management System Integration Design for Manufacturing (DFM) Design for Assembly (DFA) Preferred Qualifications Experience with Open Rack and OCP architectures. Experience supporting rack-scale AI infrastructure. Familiarity with PCIe Scale-Up and UALink architectures. Experience with Ethernet and optical networking systems. Knowledge of fiber connectivity solutions and optical packaging. Experience supporting NPO and CPO platforms. Experience developing liquid-cooled infrastructure. Experience working directly with ODM/JDM manufacturing partners. Leadership Attributes The ideal candidate will demonstrate: Strong systems thinking Strategic technical leadership Cross-functional influence Excellent communication skills Ability to drive architecture decisions across multiple organizations Passion for solving complex AI infrastructure challenges Why Join Astera Labs? You will help define the mechanical architecture for next-generation technologies including: PCIe Scale-Up AI Fabrics UALink Scale-Up Networks Ethernet Scale-Out Infrastructure ESUN Network Architectures NPO and CPO Optical Platforms Advanced Fiber Connectivity Solutions Open Rack AI Systems Future AI Factory Deployments This is an opportunity to drive the mechanical design of industry-leading products that power the world's largest AI clusters. Apply Today If you are passionate about mechanical innovation, rack-scale infrastructure, optical connectivity, and next-generation AI systems, we'd love to hear from you. The salary range is $170,000 to $210,000, depending on experience, level, and business needs. This role may be eligible for discretionary bonuses, incentives, and benefits. Join us in Research Triangle Park and help build the future of AI infrastructure. We know that creativity and innovation happen more often when teams include diverse ideas, backgrounds, and experiences, and we actively encourage everyone with relevant experience to apply, including people of color, LGBTQ+ and non-binary people, veterans, parents, and individuals with disabilities.